EPOXY RESIN MOLDING MATERIAL FOR SEALING

PURPOSE:To provide an epoxy resin molding material for sealing which causes less wear of mold by incorporating a fired talc and fused silica with a specific particle size. CONSTITUTION:The material contains a fired talc and fused silica with an average particle size of 0.5-50mum. The amount of the f...

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Hauptverfasser:	MIYATANI YOSHIHIRO, IKEDA KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide an epoxy resin molding material for sealing which causes less wear of mold by incorporating a fired talc and fused silica with a specific particle size. CONSTITUTION:The material contains a fired talc and fused silica with an average particle size of 0.5-50mum. The amount of the fired talc and fused silica is preferably 0.5-50wt.% of the whole of fillers.