DEVELOPMENT METHOD IN IC MANUFACTURING

PURPOSE:To provide a development method, in which uniform development in a wafer plane is realized in an IC manufacturing step. CONSTITUTION:While a wafer 11 is rotated at low speed, or put in a stationary state, a developer 16 is poured on the wafer 11. While the development is progressing, the dev...

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Bibliographische Detailangaben
1. Verfasser:	YONEZAWA SHINYA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a development method, in which uniform development in a wafer plane is realized in an IC manufacturing step. CONSTITUTION:While a wafer 11 is rotated at low speed, or put in a stationary state, a developer 16 is poured on the wafer 11. While the development is progressing, the developer 16 is poured again at least one time and the development step is completed. After this development step, a rinsing 18 is poured on the wafer 11 while the wafer 11 is rotated at high speed.