BINDING METHOD OF MATERIAL TO BE PLATED

PURPOSE:To hold a material to be plated for plating without causing a change with the lapse of time in an electrical connection with the material to be plated nor needing a periodical maintenance. CONSTITUTION:A jig 1c is bound to the material to be plated 5 by holding the material to be plated 5 on...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAKAGAWA TOMOO, MORIUCHI MEGUMI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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