BINDING METHOD OF MATERIAL TO BE PLATED

BINDING METHOD OF MATERIAL TO BE PLATED

PURPOSE:To hold a material to be plated for plating without causing a change with the lapse of time in an electrical connection with the material to be plated nor needing a periodical maintenance. CONSTITUTION:A jig 1c is bound to the material to be plated 5 by holding the material to be plated 5 on...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKAGAWA TOMOO, MORIUCHI MEGUMI
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:PURPOSE:To hold a material to be plated for plating without causing a change with the lapse of time in an electrical connection with the material to be plated nor needing a periodical maintenance. CONSTITUTION:A jig 1c is bound to the material to be plated 5 by holding the material to be plated 5 on a easily post-peelable conductive peast 10 coated on a holding jig 1c using a positioning jig 2, etc., and sintering as it is. A stable electrical connection is attained together with good maintenance by putting a throwaway conductive peast 10 between the material to be plated 5 and the holding jig to hold in the holding.