SEMICONDUCTOR PACKAGE AND ITS MANUFACTURE

PURPOSE:To obtain a semiconductor package which can be made smaller in size than its package size by making the semiconductor package to be provided with a semiconductor chip, connecting conductors installed to the integrated circuit section of the semiconductor chip in protruded states, and a sealing material which seals at least the integrated circuit by leaving the protruded end sections of the conductors exposed. CONSTITUTION:The title semiconductor package is provided with a semiconductor chip 22, connecting conductors 20 installed to the integrated circuit section 22a of the chip 22 in protruded states, and sealing material 28 which seals at least the section 22a by leaving the protruded end sections of the conductors 22 exposed. For example, the conductors 20 are formed at desired terminal sections of the section 22a in such a state where the conductors 20 are protruded from the section 22a. Then the conductors 20 and section 22a are coated with a sealing material 28 composed of a thermosetting resin. After coating, the protruded end sections of the conductors 20 are exposed by removing part of the sealing material 28 coating the conductors 20 and integrated circuit section 22a with abrasives, grinder, or a suitable arbitrary shaving machine.