TREATING APPARATUS

PURPOSE:To prevent invasion of treating fluid to a rear surface of an element to be treated and to hold the element to be treated by utilizing a wind pressure of gas. CONSTITUTION:An element-to-be-treated holding mechanism 10 is formed on a spinning chuck 1 for holding a wafer W. The mechanism 10 is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TATEYAMA MASANORI, TATEYAMA KIYOHISA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To prevent invasion of treating fluid to a rear surface of an element to be treated and to hold the element to be treated by utilizing a wind pressure of gas. CONSTITUTION:An element-to-be-treated holding mechanism 10 is formed on a spinning chuck 1 for holding a wafer W. The mechanism 10 is composed of a rotor 11 rotating upon receiving of a wind pressure of N2 gas, a plurality of element-to-be-treated holding pawls 12 arranged on a periphery of the chuck 1, and a transmission link 13 for transmitting a rotary motion of the rotor 11 to the pawls 12. Thus, the rotor 11 is rotated by the wind pressure of the gas to be supplied to the rear surface of the wafer W placed on the chuck 1, the rotary motion of the rotor 11 is transmitted to the pawls 12 through the link 13, and a peripheral edge of the wafer W is held by the pawls 12. Further, roundabout introduction of treating fluid to the rear surface of the wafer W can be prevented by the gas.