CONDUCTIVE PASTE

PURPOSE:To reduce the insulating resistance between through holes, and to reduce the using amount of silver, by including a specific almost spherical form of minute particles, a copper powder, zeolite, and a thiazole genus, to a conductive paste. CONSTITUTION:(A) 20 to 60wt.% of almost spherical for...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YAMANA SHOZO, KUWASHIMA HIDEJI
Format: Patent
Sprache:eng
Schlagworte:
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