CONDUCTIVE PASTE

PURPOSE:To reduce the insulating resistance between through holes, and to reduce the using amount of silver, by including a specific almost spherical form of minute particles, a copper powder, zeolite, and a thiazole genus, to a conductive paste. CONSTITUTION:(A) 20 to 60wt.% of almost spherical for...

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Bibliographische Detailangaben
Hauptverfasser: YAMANA SHOZO, KUWASHIMA HIDEJI
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To reduce the insulating resistance between through holes, and to reduce the using amount of silver, by including a specific almost spherical form of minute particles, a copper powder, zeolite, and a thiazole genus, to a conductive paste. CONSTITUTION:(A) 20 to 60wt.% of almost spherical form of particles which consist of a plastic or an inorganic material with the particle size less than 30mum, on whose surface a nickel plating with the thickness 1 to 2mum is applied, and a silver plating with the thickness 0.5 to 1mum is applied thereover, and (B) a copper powder whose particle size is less than 20mum, are mixed at the volume ratio 10:1 to 1:5 to form a mixture. The resultant mixture (A+B), (C) zeolite, (D) 0.05 to 2.0wt.% of a thiazole genus, and (E) an organic adhesive component, and when necessary, a solvent, a minute graphite power, a corrosion depressor, and the like, are mixed to form this conductive paste.