SEMICONDUCTOR DEVICE HIGH IN INTEGRATION DEGREE

PURPOSE:To facilitate handling of packages in a laminating process and to improve reliability by making the packages have the same construction irrespective of positions in lamination, in a semiconductor device of a high integration degree wherein the packages each packaging at least one semiconduct...

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Bibliographische Detailangaben
Hauptverfasser:	SHIBATA SUSUMU, KOYAMA KAZUNARI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To facilitate handling of packages in a laminating process and to improve reliability by making the packages have the same construction irrespective of positions in lamination, in a semiconductor device of a high integration degree wherein the packages each packaging at least one semiconductor element are laminated in a plurality. CONSTITUTION:When the number of wirings provided for one semiconductor element is made two and layers of packages 15a to 15d are made four in number, eight discrete wirings 16a, 16b, 17a to 17f and others are provided respectively on the surface and rear sides of each of the packages 15a to 15d and the discrete wirings 16a 17f on the surface side and the discrete wirings on the rear side are so disposed as to be shifted by two pitches from each other, while the discrete wirings on these sides are connected through via holes 26a, 26b and 27a to 27f together.