INTEGRATED CIRCUIT DEVICE

PURPOSE:To realize an integrated circuit device having the very simple structure and high reliability at a low cost without warping of the entire substrate and cracks in the substrate and without dissolution with solder with regard to the integrated circuit device, wherein an element is mounted on the substrate and attached to a heat sink. CONSTITUTION:On a ceramic substrate 3, a circuit conductor 12 is formed, and an element 5 is mounted. The ceramic substrate 3 is in contact with a heat sink 1 through nonconductive resin 2. A metal case 9 covers the ceramic substrate 3 and has a contact plate 13, which pushes the circuit conductor 12 provided on the ceramic substrate 3. These parts are provided. A part of the metal case 9 is bent, and the ceramic substrate 3 and the heat sink 1 are brought into contact with pressure through the resin 2. The contact plate 13 of the metal case 9 is brought into contact with the circuit conductor 12 on the ceramic substrate 3 so as to obtain the equal potential in this constitution.