JPH0633453B

The layers are applied to a substrate by means of the cathodic sputtering process. A mechanical orifice (25) which divides the space between the cathode (6) and the substrate (4) to be coated is provided between the cathode (6) to be sputtered and the anode (29). In addition, a glow discharge is pro...

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Bibliographische Detailangaben
Hauptverfasser:	KURAUSU HAATEITSUHI, ANTON DEIITORITSUHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The layers are applied to a substrate by means of the cathodic sputtering process. A mechanical orifice (25) which divides the space between the cathode (6) and the substrate (4) to be coated is provided between the cathode (6) to be sputtered and the anode (29). In addition, a glow discharge is provided both between the cathode (6) to be sputtered and the orifice (25) and between the anode (19) and the orifice (25) (Figure 1).