RESIN SEALED SEMICONDUCTOR DEVICE

PURPOSE:To enhance heat dissipation characteristics while preventing package crack. CONSTITUTION:The resin sealed semiconductor device comprises a semiconductor chip 15 mounted on an island 16 provided for a lead frame, a plurality of suspension leads 13 formed continuously on the island 16, and a h...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KUDO YOSHIMASA, KANNO SHIGETO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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