RESIN SEALED SEMICONDUCTOR DEVICE
PURPOSE:To enhance heat dissipation characteristics while preventing package crack. CONSTITUTION:The resin sealed semiconductor device comprises a semiconductor chip 15 mounted on an island 16 provided for a lead frame, a plurality of suspension leads 13 formed continuously on the island 16, and a h...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PURPOSE:To enhance heat dissipation characteristics while preventing package crack. CONSTITUTION:The resin sealed semiconductor device comprises a semiconductor chip 15 mounted on an island 16 provided for a lead frame, a plurality of suspension leads 13 formed continuously on the island 16, and a heat plate 17 to be bonded to the plurality of suspension leads 13, wherein each of the plurality of suspension leads 13 extends to the outside of the resin sealed semiconductor device and bonded to the heat plate 17 through a bonding tape 18. |
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