MULTILAYERED LEAD FRAME AND SEMICONDUCTOR PACKAGE

PURPOSE:To facilitate multipin structure, and easily realize impedance matching. CONSTITUTION:Terminal parts which are laminated on the inner sides of a single layer lead frame 21 and a single layer lead frame 21 on which sides a semiconductor element 29 is mounted, and electrically connected with t...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TAKENOUCHI TOSHIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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