MULTILAYERED LEAD FRAME AND SEMICONDUCTOR PACKAGE

MULTILAYERED LEAD FRAME AND SEMICONDUCTOR PACKAGE

PURPOSE:To facilitate multipin structure, and easily realize impedance matching. CONSTITUTION:Terminal parts which are laminated on the inner sides of a single layer lead frame 21 and a single layer lead frame 21 on which sides a semiconductor element 29 is mounted, and electrically connected with t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: TAKENOUCHI TOSHIICHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE:To facilitate multipin structure, and easily realize impedance matching. CONSTITUTION:Terminal parts which are laminated on the inner sides of a single layer lead frame 21 and a single layer lead frame 21 on which sides a semiconductor element 29 is mounted, and electrically connected with the semiconductor element to be mounted are provided. A multilayered circuit board 25 is electrically connected with inner leads 23 of the single layer lead frame 21. The multilayered circuit board 25 is formed as follows; films 12 having viaholes are stacked to form a laminate of two or more layers, and circuit patterns formed on the film surfaces by using copper foils are electrically connected through the viaholes.