WIRING BOARD AND MANUFACTURE THEREOF

PURPOSE:To provide a wiring board having a contact hole capable of restraining contact resistance between an upper wiring terminal and a lower layer wining laid via an insulation film for realizing pertinent coverage for a wiring connection, as well as a method for manufacturing the board. CONSTITUT...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ITANI AKIRA, HIROBE TOSHIHIKO, HIRAKI JUNICHI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To provide a wiring board having a contact hole capable of restraining contact resistance between an upper wiring terminal and a lower layer wining laid via an insulation film for realizing pertinent coverage for a wiring connection, as well as a method for manufacturing the board. CONSTITUTION:The upper gate bus line terminal 6 of a board and a contact hole 7 for connecting the terminal 6 to a gate bus line 3 have a stripe structure where a plurality of grooves of prescribed width are formed on the surface of the second gate insulation film 5 at the prescribed distance. The grooves penetrate the first and second gate insulation films 4 and 5, and are further extended by the prescribed distance from a position reaching the surface of the gate bus line 3. Thus, the contact area of the terminal 6 and bus line 3 extended to the position of such depth becomes larger by an amount corresponding to the area of the side wall of the extended section.