HYBRID INTEGRATED CIRCUIT

PURPOSE:To increase the allowable value of a current flowing through a thin film pattern. CONSTITUTION:A thin film pattern 2a for electric wiring is formed on the surface of a ceramic substrate 1. A bonding wire 2b is formed on the thin film pattern 2, so as to come into contact with the thin film p...

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Bibliographische Detailangaben
1. Verfasser:	HAMAGUCHI TATSUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To increase the allowable value of a current flowing through a thin film pattern. CONSTITUTION:A thin film pattern 2a for electric wiring is formed on the surface of a ceramic substrate 1. A bonding wire 2b is formed on the thin film pattern 2, so as to come into contact with the thin film pattern 2a, at a plurality of parts containing both ends of the bonding wire 2b, by transforming the bonding wire into a wavy type in the lenth direction of the thin film pattern 2a.