MOLD FOR MOLDING LIQUID RESIN

PURPOSE:To prevent the warp of a molded form by a method wherein the surface layer of a cavity mold is constituted of a thin metallic layer, a temperature regulatng pipeline is provided on the rear surface of the surface layer and a heat transfer resistance at a site contacting with the thick part o...

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Bibliographische Detailangaben
Hauptverfasser: IDE NORIAKI, OKUMURA KINICHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To prevent the warp of a molded form by a method wherein the surface layer of a cavity mold is constituted of a thin metallic layer, a temperature regulatng pipeline is provided on the rear surface of the surface layer and a heat transfer resistance at a site contacting with the thick part of the molded form is made lower than the heat transfer resistance of a site contacting with a thin part. CONSTITUTION:The surface layer of a cavity mold 2, formed of a resin 7 for mold, is formed of a thin copper sheet 4 while a temperature regulating pipe 5 or a copper pipe is arranged on the rear surface of the surface layer. In this case, a distance between the temperature regulaitng pipe 5 and the surface layer is formed so that the heat transfer resistance of a site, contacting with the coping member of the thick part A1 of a core mold 3 becomes 1/3-1/4 of the heat transfer resistance of the other side contacting with the coping part of a thin part A2. Resin is poured into a cavity formed by the core mold 3 and the cavity mold 2. Accordingly, the warp of a molded form, consisting of a thick part A1 and the thin part A2, is reduced and the molding cycle of the mold can be shortened.