MOISTURE-CURING TYPE REACTIVE HOT-MELT ADHESIVE COMPOSITION

PURPOSE:To obtain the subject composition having excellent workability, adhesiveness and heat resistance and also low toxicity. CONSTITUTION:This adhesive composition is obtained by blending (A) 100 pts.wt. of a polymer having hydrolyzable silicon-containing functional group with (B) 30-200 pts.wt....

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Bibliographische Detailangaben
Hauptverfasser:	MATSUURA NOBUTERU, KANEMURA ATSUSHI, UECHI KENJI, MATSUI TORU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the subject composition having excellent workability, adhesiveness and heat resistance and also low toxicity. CONSTITUTION:This adhesive composition is obtained by blending (A) 100 pts.wt. of a polymer having hydrolyzable silicon-containing functional group with (B) 30-200 pts.wt. of a resin for providing solidification at normal temperature and (C) 0.1-20 pts. wt. of a silanol condensation catalyst.