LEAD FRAME, MOLDING DIE, MANUFACTURE OF SEMICONDUCTOR DEVICE, AND SEMI-MANUFACTURED SEMICONDUCTOR ELEMENT

PURPOSE:To improve the utilizing efficiency of a resin so as to reduce the cost of the resin by injecting the resin into cavities arranged in a plurality of rows in a lead frame from a single runner. CONSTITUTION:A lead frame 11 is equipped with four rows of patterns 12 in the width direction, with...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TATE HISAFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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