LEAD FRAME, MOLDING DIE, MANUFACTURE OF SEMICONDUCTOR DEVICE, AND SEMI-MANUFACTURED SEMICONDUCTOR ELEMENT

PURPOSE:To improve the utilizing efficiency of a resin so as to reduce the cost of the resin by injecting the resin into cavities arranged in a plurality of rows in a lead frame from a single runner. CONSTITUTION:A lead frame 11 is equipped with four rows of patterns 12 in the width direction, with each pattern being composed of a plurality of patterns arranged in line in the length direction, and the rows next to the outermost rows in the width direction of the frame 11 are shifted against the outermost rows in the length direction of the frame 11. Main runners 13 provided at both ends of the frame 11 in the width direction respectively inject a resin not only into cavities 14 in the outermost rows, but also into cavities 14 in the rows next to the outermost rows through the gaps between each cavity 14 in the outermost rows. Therefore, one runner 13 can inject the resin into the two rows of cavities 14.