PALLADIUM PLATING SOLUTION AND PALLADIUM PLATING METHOD USING THE SAME

PALLADIUM PLATING SOLUTION AND PALLADIUM PLATING METHOD USING THE SAME

PURPOSE:To obtain a Pd plating soln. emitting no ammoniac odor, hardly causing self-decomposition because of its chemical stability and capable of giving Pd plating having satisfactory adhesion to a body to be plated. CONSTITUTION:This Pd plating soln. contains 5-30g/l (expressed in terms of metal P...

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Bibliographische Detailangaben
1. Verfasser: AKAZA TOSHIYUKI
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Zusammenfassung:PURPOSE:To obtain a Pd plating soln. emitting no ammoniac odor, hardly causing self-decomposition because of its chemical stability and capable of giving Pd plating having satisfactory adhesion to a body to be plated. CONSTITUTION:This Pd plating soln. contains 5-30g/l (expressed in terms of metal Pd) acidic compd. of Pd (II) and 30-500g/l weak org. acid as an electric conductive salt. used to adjust this plating soln. to