SEMICONDUCTOR LEAD FRAME PLATING DEVICE

PURPOSE:To provide the title semiconductor lead frame plating device capable of removing any residual smut on a lead frame surface caused by etching step for obviating defective plating such as defective bonding, etc. CONSTITUTION:Within the title semiconductor lead frame plating device equipped wit...

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Bibliographische Detailangaben
Hauptverfasser:	SENDAI SATOSHI, HONGO AKIHISA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE:To provide the title semiconductor lead frame plating device capable of removing any residual smut on a lead frame surface caused by etching step for obviating defective plating such as defective bonding, etc. CONSTITUTION:Within the title semiconductor lead frame plating device equipped with a degreasing means 1, a washing means 2, an etching means 3, another washing means 4, a pre-dipping means 5, a solder plating means 6, the other washing means 7, an alkali neutralizing means 8, the other washing means-9 and a drying means 10, an ultrasonic cleaning means 11 for ultrasonic cleaning step is provided between the etching means 3 and the solder plating means 6. Next, after finishing the etching step by the etching means 3, the semiconductor lead frames are to be ultrasonic-cleaned by the ultrasonic cleaning means 11 to be solder plated later.