PUMP DEVICE

PURPOSE: To provide a pump device capable of easily controlling the thermal and mechanical stress in a component of a main pump part. CONSTITUTION: This pump device is provided with a high-pressure pump type main pump part 10 and a fluid supply pump 11, and an excessive fluid from a supply pump is r...

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Hauptverfasser: FURANTSU PABERETSUKU, BERUNHARUTO ARUNORUTO, EGON AIZENBATSUHAA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE: To provide a pump device capable of easily controlling the thermal and mechanical stress in a component of a main pump part. CONSTITUTION: This pump device is provided with a high-pressure pump type main pump part 10 and a fluid supply pump 11, and an excessive fluid from a supply pump is returned to a tank T along discharge passages 52, 54, S, S1 , S2 , 33, 82. In order to improve the efficiency and the reliability only by slightly modifying the pump, area 20, 22, 26-28, 40, 70, 84 of the main pump part subjected to large thermal stress or mechanical stress are arranged along the discharge passages 52, 54, S, S1 , S2 , 33, 82, and are effectively cooled with the excessive fluid to be returned to the tank T.