JPH0623840B

Photoresist formulations for forming relief structures from highly heat-resistant polyimide polymers, containing in an organic solvent in essence at least (a) one polyamide ester prepolymer carrying photopolymerizable radicals (b) a radiation-reactive copolymerizable unsaturated compound (c) a photo...

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Bibliographische Detailangaben
Hauptverfasser: HANSU YOAHIMU MEREMU, TOOMASU HERORUDO, RUDORUFU KURUTSU
Format: Patent
Sprache:eng
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Zusammenfassung:Photoresist formulations for forming relief structures from highly heat-resistant polyimide polymers, containing in an organic solvent in essence at least (a) one polyamide ester prepolymer carrying photopolymerizable radicals (b) a radiation-reactive copolymerizable unsaturated compound (c) a photosensitizer (d) a photoinitiator (e) a leuco dye, exhibit enhanced photosensitivity if they contain as the photoinitiator a compound of the type of the N-azidosulphonylarylmaleimides and as leuco dye a compound of the type of the triarylmethanes.