SEMICONDUCTOR PRESSURE SENSOR

SEMICONDUCTOR PRESSURE SENSOR

PURPOSE:To obtain a semiconductor pressure sensor capable of suppressing the resonance of the inside parts of the outer leads in a package, and preventing wire from being broken. CONSTITUTION:A package base 6A has a gluing and supporting part 6B capable of supporting nearly all the length of the ins...

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1. Verfasser: ICHIHASHI MOTOMI
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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creator ICHIHASHI MOTOMI
description PURPOSE:To obtain a semiconductor pressure sensor capable of suppressing the resonance of the inside parts of the outer leads in a package, and preventing wire from being broken. CONSTITUTION:A package base 6A has a gluing and supporting part 6B capable of supporting nearly all the length of the inside parts 4a of the outer leads in a package. Besides, adhesive agent positioning protrusions 6a for determining the gluing regions of adhesive agents 8c and 8d are provided on the gluding surface of the package base 6A with a package cap 7. Consequently, it becomes possible to suppress resonance and prevent wire from being broken, by solving the single-side holding state of the outer leads. Besides, it also becomes possible to improve the airtightness of the package.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title SEMICONDUCTOR PRESSURE SENSOR
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