SEMICONDUCTOR PRESSURE SENSOR

PURPOSE:To obtain a semiconductor pressure sensor capable of suppressing the resonance of the inside parts of the outer leads in a package, and preventing wire from being broken. CONSTITUTION:A package base 6A has a gluing and supporting part 6B capable of supporting nearly all the length of the ins...

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Bibliographische Detailangaben
1. Verfasser:	ICHIHASHI MOTOMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a semiconductor pressure sensor capable of suppressing the resonance of the inside parts of the outer leads in a package, and preventing wire from being broken. CONSTITUTION:A package base 6A has a gluing and supporting part 6B capable of supporting nearly all the length of the inside parts 4a of the outer leads in a package. Besides, adhesive agent positioning protrusions 6a for determining the gluing regions of adhesive agents 8c and 8d are provided on the gluding surface of the package base 6A with a package cap 7. Consequently, it becomes possible to suppress resonance and prevent wire from being broken, by solving the single-side holding state of the outer leads. Besides, it also becomes possible to improve the airtightness of the package.