PACKAGING METHOD OF SEMICONDUCTOR CHIP

PURPOSE:To stably supply the products at low cost by a method wherein the steps in high massproductivity are established by the quality improvement due to low temperature assembling step and the in-line packaging step. CONSTITUTION:This packaging method is composed of the partially removing step of...

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Bibliographische Detailangaben
Hauptverfasser:	UCHINO TSUGUO, TOYODA MIWAKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To stably supply the products at low cost by a method wherein the steps in high massproductivity are established by the quality improvement due to low temperature assembling step and the in-line packaging step. CONSTITUTION:This packaging method is composed of the partially removing step of an oxide film 22 to be formed into an outer lead and the rolling step of a metallic film 23 to be pressure-fixed after exposing a newly formed surface. At this time, the oxide film 22 is left intact between a sealing resin and the metallic foil 23 to prevent any solder bridge in the later soldering step. Furthermore, the packaging step can be in-lined to improve the quality of the products by performing the packaging step at low temperature.