CHIP TYPE SOLID ELECTROLYTIC CAPACITOR

PURPOSE:To prevent the breakdown of a capacitor element at the time of applying a voltage across the capacitor by misunderstanding the polarity by providing two exposed surfaces of a cathode conductive layer, two cathode terminal electrodes formed on an exterior insulating resin layer around the two surfaces, and an anode terminal electrode connected to a belt-like anode lead and formed at the center of a chip. CONSTITUTION:An exterior insulating resin layer 4 is formed by masking an anode lead 2 and two facing surfaces adjacent to a surface on which the lead 2 is erected. Then a conducive layer 5 is formed by baking silver paste applied to a cathode conductive layer exposed by the masking and the layer 4 around the conductive layer. After forming the layer 5, the butyl acetate solution of palladium and an amine compound is applied in a belt-like state to the centers of an anode lead leading-out surface and one surface which is adjacent to the anode lead erecting surface and forms the layer 4. Then the paste is baked at 180 deg.C for 10 minutes so as to stick the palladium which is a metallic catalyst to the surfaces. Finally plated layers 6 and soldered layers 7 are formed on the parts to which the palladium are stuck.