DIELECTRIC SUBSTRATE
PURPOSE:To provide a dielectric substrate which contains a polyolefin resin layer as a dielectric layer and improved in adhesion property and heat resistance while such excellent features as the ultra-low dielectric constant and ultra-low dielectric loss the polyolefin resin has are maintained. CONS...
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| creator | URAGAMI AKIRA FUKUTAKE SUNAO OHASHI KAZUHIKO OKINO KOICHI |
| description | PURPOSE:To provide a dielectric substrate which contains a polyolefin resin layer as a dielectric layer and improved in adhesion property and heat resistance while such excellent features as the ultra-low dielectric constant and ultra-low dielectric loss the polyolefin resin has are maintained. CONSTITUTION:The title substrate is constituted by laminating a porous fluoroplastic film on at least one surface of a polyolefin resin sheet or by coating the surface of the porous fluoroplastic film with a conductive layer after laminating the porous fluoroplastic film on at least one surface of the polyolefin resin sheet. |
| format | Patent |
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| language | eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING |
| title | DIELECTRIC SUBSTRATE |
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