DIELECTRIC SUBSTRATE

PURPOSE:To provide a dielectric substrate which contains a polyolefin resin layer as a dielectric layer and improved in adhesion property and heat resistance while such excellent features as the ultra-low dielectric constant and ultra-low dielectric loss the polyolefin resin has are maintained. CONS...

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Bibliographische Detailangaben
Hauptverfasser:	URAGAMI AKIRA, FUKUTAKE SUNAO, OHASHI KAZUHIKO, OKINO KOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a dielectric substrate which contains a polyolefin resin layer as a dielectric layer and improved in adhesion property and heat resistance while such excellent features as the ultra-low dielectric constant and ultra-low dielectric loss the polyolefin resin has are maintained. CONSTITUTION:The title substrate is constituted by laminating a porous fluoroplastic film on at least one surface of a polyolefin resin sheet or by coating the surface of the porous fluoroplastic film with a conductive layer after laminating the porous fluoroplastic film on at least one surface of the polyolefin resin sheet.