SURFACE MOUNTED SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

PURPOSE:To provide a surface mounted semiconductor device generating neither plating cutting scraps nor plating grinding scraps at the time of molding outer leads of a surface mounting type semiconductor device having the outer leads in the gull wing shape, moreover generating no deficit in solder s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MINAMIDE AKIZO, KIMURA HIROSHI, MAEDA TAKAMICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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