SURFACE MOUNTED SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

SURFACE MOUNTED SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

PURPOSE:To provide a surface mounted semiconductor device generating neither plating cutting scraps nor plating grinding scraps at the time of molding outer leads of a surface mounting type semiconductor device having the outer leads in the gull wing shape, moreover generating no deficit in solder s...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MINAMIDE AKIZO, KIMURA HIROSHI, MAEDA TAKAMICHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE:To provide a surface mounted semiconductor device generating neither plating cutting scraps nor plating grinding scraps at the time of molding outer leads of a surface mounting type semiconductor device having the outer leads in the gull wing shape, moreover generating no deficit in solder supply at the time of mounting a substrate, and manufacture thereof. CONSTITUTION:A projected plating layer 15 is formed only on one surface of a substrate land contact part 6 of an outer lead 4 of a surface mounting type semiconductor device having outer leads in the shape of a gull wing.