SURFACE MOUNTED SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

PURPOSE:To provide a surface mounted semiconductor device generating neither plating cutting scraps nor plating grinding scraps at the time of molding outer leads of a surface mounting type semiconductor device having the outer leads in the gull wing shape, moreover generating no deficit in solder s...

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Hauptverfasser:	MINAMIDE AKIZO, KIMURA HIROSHI, MAEDA TAKAMICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	MINAMIDE AKIZO KIMURA HIROSHI MAEDA TAKAMICHI
description	PURPOSE:To provide a surface mounted semiconductor device generating neither plating cutting scraps nor plating grinding scraps at the time of molding outer leads of a surface mounting type semiconductor device having the outer leads in the gull wing shape, moreover generating no deficit in solder supply at the time of mounting a substrate, and manufacture thereof. CONSTITUTION:A projected plating layer 15 is formed only on one surface of a substrate land contact part 6 of an outer lead 4 of a surface mounting type semiconductor device having outer leads in the shape of a gull wing.
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CONSTITUTION:A projected plating layer 15 is formed only on one surface of a substrate land contact part 6 of an outer lead 4 of a surface mounting type semiconductor device having outer leads in the shape of a gull wing.</description><edition>5</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1994</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940128&DB=EPODOC&CC=JP&NR=H0621301A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940128&DB=EPODOC&CC=JP&NR=H0621301A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MINAMIDE AKIZO</creatorcontrib><creatorcontrib>KIMURA HIROSHI</creatorcontrib><creatorcontrib>MAEDA TAKAMICHI</creatorcontrib><title>SURFACE MOUNTED SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF</title><description>PURPOSE:To provide a surface mounted semiconductor device generating neither plating cutting scraps nor plating grinding scraps at the time of molding outer leads of a surface mounting type semiconductor device having the outer leads in the gull wing shape, moreover generating no deficit in solder supply at the time of mounting a substrate, and manufacture thereof. 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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	SURFACE MOUNTED SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
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