EPOXY RESIN MOLDING MATERIAL FOR SEALING

PURPOSE:To obtain an epoxy resin molding material for sealing having high thermal conductivity and high moisture resistance and excellent in moldability. CONSTITUTION:The epoxy resin for sealing contains a alumina having >=99.5wt.% purity,

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Bibliographische Detailangaben
Hauptverfasser:	ICHIKAWA TAKAYUKI, KYOTANI YASUHIRO, MIYATANI YOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain an epoxy resin molding material for sealing having high thermal conductivity and high moisture resistance and excellent in moldability. CONSTITUTION:The epoxy resin for sealing contains a alumina having >=99.5wt.% purity,