JPH0618190B

PURPOSE:To obtain films for preventing damage used in polishing Si wafers and the like by a method wherein a substrate film having a specific hardness is stuck to the wafer surface via self-adhesive. CONSTITUTION:As the substrate film, a film made of thermoplastic or thermosetting synthetic resin or...

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Bibliographische Detailangaben
Hauptverfasser:	KOMATSU KAZUYOSHI, NARIMATSU OSAMU, ITO MICHASU, SHIBATA YASUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES POLISHING SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain films for preventing damage used in polishing Si wafers and the like by a method wherein a substrate film having a specific hardness is stuck to the wafer surface via self-adhesive. CONSTITUTION:As the substrate film, a film made of thermoplastic or thermosetting synthetic resin or natural or synthetic rubber having a Shore D type hardness of 40 or less preferably 30 or less can be suitably selected out of marketing products. A hardness of over 40 can not substantially prevent damage in wafer polishing. As the self-adhesive provided on the surface of the substrate film, a self-adhesive e.g. of acrylic, ester, or urethane series or a self-adhesive of synthetic rubber series which is normal one in market can be used. This film is abundant in flexibility and has the property of absorbing and dispersing the outer force; therefore, polishing the back by sticking this film to the wafer surface can prevent wafer damage.