WATER-BASED COATING COMPOSITION

PURPOSE:To provide a water-based coating composition which is applied to the interior surface of a metallic can which needs to be highly processable and corrosion-resistant by coating a metallic substrate with the composition directly or through an undercoat and backing the applied film. CONSTITUTIO...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	NAKAMURA TETSUHISA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a water-based coating composition which is applied to the interior surface of a metallic can which needs to be highly processable and corrosion-resistant by coating a metallic substrate with the composition directly or through an undercoat and backing the applied film. CONSTITUTION:The coating composition comprises 5-40wt.% epoxy resin (A), 25-80wt.% phenoxy resin (B), 7-30wt.% carboxylated acrylic polymer (C) and 2-30wt.% water-based aminoplast resin (D) as the constituents, and an ammonia salt of a reaction product of epoxy resin A with phenoxy resin B and carboxylated acrylic polymer D and/or an amine salt thereof and water-based aminoplast resin D are used. The contained phenoxy resin skeleton as a linear high-molecular-weight resin can impart processability to the composition, and the contained epoxy resin skeleton and resol phenolic resin can improve the adhesion to a substrate and can impart corrosion resistance owing to the increased cross-linking density after curing.