SEMICONDUCTOR PACKAGE

PURPOSE: To provide a semiconductor package capable of simplifying the process of being packaged on a printed circuit board and preventing the deformation of a lead even in the case of using the lead frame of a thin film type. CONSTITUTION: In this semiconductor package 30 provided with a package bo...

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Bibliographische Detailangaben
Hauptverfasser:	RI SHIYUNKI, JIEON HIEONNJIYO, KIN KIYOUSHIYOU, KEN GOSHIYOKU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	PURPOSE: To provide a semiconductor package capable of simplifying the process of being packaged on a printed circuit board and preventing the deformation of a lead even in the case of using the lead frame of a thin film type. CONSTITUTION: In this semiconductor package 30 provided with a package body 32 for protecting a packaged semiconductor chip and the lead 34 projected and bent to one side of the package body 32, supporting bases 36 projected in a prescribed shape to both ends of two surfaces in contact with the surface where the lead 34 of the package body 32 is projected and formed by the same material as the package body 32 and a groove part 38 formed so as to house the projected lead 34 between the supporting bases 36 are provided and the semiconductor package 36 is packaged so as to bring the supporting bases 36 into contact with the upper surface of the printed circuit board. The deformation of the lead 34 is prevented and the semiconductor package 30 is stably supported.