PHOTOSENSITIVE RESIN COMPOSITION

PURPOSE:To improve thermal stability of a completely saponified or partially saponified polyvinylacetate photosensitive resin compsn. soln. and its photosensitive resin printing plate and to improve productivity of the molding process and storage property of the printing plate by constituting the co...

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Bibliographische Detailangaben
Hauptverfasser:	KASHIO SHIGETORA, INAMURA HIROFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	PURPOSE:To improve thermal stability of a completely saponified or partially saponified polyvinylacetate photosensitive resin compsn. soln. and its photosensitive resin printing plate and to improve productivity of the molding process and storage property of the printing plate by constituting the compsn. of specified four components. CONSTITUTION:This compsn. consists of at least the following components. These are 100 pts.wt. of completely saponified or partially saponified polyvinyl acetate having 50-100mol% saponification degree, 20-300 pts.wt. of photopolymerizable unsatd. compd. having ethylenical double bonds in the molecule, 0.1-10 pts.wt. of photopolynm. initiator, and 0.01-5 pts.wt. of a metal phosphate. As for the metal phosphate, alkali metal salt such as lithium or sodium hypophosphite is used. By adding a small amt. of metal phosphate, thermal stability of the compsn. is significantly improved so that compsn. can be molded at a high temp. as 90 to 100 deg.C. Further, by this method, casting of the photosensitive resin compsn. soln. of a high concentration or high temp drying of the compsn. are possible.