PLATING TREATMENT DEVICE FOR HOOP MATERIAL

PURPOSE:To shorten the distances at which a hoop material comes into contact with air and to enable the continuous execution of a plating treatment with good quality by passing the hoop material through the inside of tanks from which respective liquid chemicals are allowed to overflow at the time of transporting the hoop material straight in the approximately horizontal direction within plural liquid chemical treatment sections. CONSTITUTION:The hoop-shaped frame F is successively transported in perpendicularly upright state rectilinearly in the approximately horizontal direction in an electrolytic degreasing treatment region A, frame etching treatment region B, a solder plating region C, a neutralizing and final cleaning region D and a drying treatment region E, by this, the frame is subjected to a plating treatment. The liquid chemicals in the respective reservoir tanks 15 are sucked up respectively into the overflow tanks 16 and the hoop material F is passed in these liquid chemicals in the regions A, B, C at the time. The liquid chemical in the reservoir tank 24 is blown to the hoop material F via nozzles 25 in the region D. As a result, the distances between the respective liquid chemical treatment regions A, B, C, D, E are shortened to lessen the contact of the hoop material F stuck with the liquid chemicals with air and the reception of the adverse influence thereof, such as discoloration or oxidation.