FLUID TREATING DEVICE AND METHOD

PURPOSE: To obtain high treatment efficiency by forming two rows of injection holes arranged apart spaced intervals in a transverse direction of an injector plate constituting a substrate transporting surface before and behind in a substrate transporting direction and transporting substrate while th...

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Bibliographische Detailangaben
Hauptverfasser:	SUTEIIBUN RINTSU BAADO, JIEFURII DONARUDO JIYOONZU, OSUKAA OREO MORENO, ROBAATO HENRII KATEIRU, RONARUDO JIEEMUSU MUUA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY CLEANING CLEANING IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING WEAPONS
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Beschreibung
Zusammenfassung:	PURPOSE: To obtain high treatment efficiency by forming two rows of injection holes arranged apart spaced intervals in a transverse direction of an injector plate constituting a substrate transporting surface before and behind in a substrate transporting direction and transporting substrate while the substrate is subjected to the fluid-treatment by the fluid bearing effect generated by the jet of fluid. CONSTITUTION: Plenum housings 20 and 120 having plenum chambers 30 and 130 to which the fluid is supplied by tubes 40 and 140 are arranged one above the other across the prescribed spacing constituting the substrate transporting space. At least two rows of isolated drill holes 60, 70 and 160, 170 are formed at the connected injector plates 50 and 150 constituting the upper part and lower part of the respective housings 20 and 120. Rollers 80 and 90 for transporting the substrates, such as printed circuit boards, are arranged at the inlet end 54 and outlet end 56 of the substrate transporting space. The substrate carried into the apparatus by the roller 80 on the inlet side is transported by the fluid bearing effect by the jet from the first hole 60 row and the back flow accompanying the fluid from the holes 60 is promoted by the jet from the second hole 70 row.