LINKED THIN FILM PARTS

PURPOSE:To remarkably improve handling ability without occurrence of frame bending phenomenon by forming a region having the smallest intra-surface rigidity for each part element to the area adjacent to the reference hole provided on a frame and leaving slitless region in the longitudinal direction...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: UMAGOE YUKIMORI, SHIRAKI KIYONORI, MASUKAWA TETSUO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To remarkably improve handling ability without occurrence of frame bending phenomenon by forming a region having the smallest intra-surface rigidity for each part element to the area adjacent to the reference hole provided on a frame and leaving slitless region in the longitudinal direction of the frame without giving any expandability. CONSTITUTION:Slits Sa, Sb are provided in the region adjacent to a reference hole 51 of a frame 5 on which each part element is arranged adjacently with the one end being connected to freely expand the region adjacent to the reference hole 51. Therefore, without deformation of the portions 5a, 5b of the part element having small rigidity, the reference hole 51 can be accurately and easily engaged with and positioned to a reference pin for the positioning of an assembling jig. Moreover, any slit is not provided in the region B of the region adjacent to the reference hole 51 of the frame 5 in order to prevent drop of rigidity of the frame 5. Accordingly, assembling engagement accuracy of a linked thin film part can be improved, handling ability can be improved and yield of the part having passed can also be improved remarkably.