INNER LEAD OF FILM CARRIER FOR TAB AND MANUFACTURE THEREOF

INNER LEAD OF FILM CARRIER FOR TAB AND MANUFACTURE THEREOF

PURPOSE:To see that positional dislocation does not occur between each inner lead and each bump on an IC chip, and that dispersion does not occur in junction. CONSTITUTION:In the inner lead 1 of a film carrier for TAB, a recessed bump junction 3 is formed by widening the width of the bump junction a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OTADA MASAMI, WATABE SHINOBU, MATSUI EITARO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE:To see that positional dislocation does not occur between each inner lead and each bump on an IC chip, and that dispersion does not occur in junction. CONSTITUTION:In the inner lead 1 of a film carrier for TAB, a recessed bump junction 3 is formed by widening the width of the bump junction at the top of the inner lead 1 and inclining the widened part to the side of a bump junction face so as to make a guide ramp 2.