MANUFACTURE OF FILM CARRIER FOR TAB

PURPOSE:To perform highly reliable formation of a bump and solder giving and soldering without requiring much labor. CONSTITUTION:In a manufacture of a film carrier 30 for a film for TAB, which forms a bump for junctioning an IC chip or a solder junction for mounting electronic parts, the bump and t...

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Bibliographische Detailangaben
Hauptverfasser:	OTADA MASAMI, WATABE SHINOBU, MATSUI EITARO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To perform highly reliable formation of a bump and solder giving and soldering without requiring much labor. CONSTITUTION:In a manufacture of a film carrier 30 for a film for TAB, which forms a bump for junctioning an IC chip or a solder junction for mounting electronic parts, the bump and the solder junction can be formed at the same time by exposing the film carrier 30 for TAB, where a resist agent is applied on the section not requiring bumps or solder, continuously to solder steam through a solder steam vessel 10.