PLASMA TREATING DEVICE

PURPOSE:To prevent the thermal stress cracking of a target by finely dividing the target in the plasma treating device with a groove of specified shape and preventing an ion in plasma from reaching the surface of a target electrode. CONSTITUTION:A substrate 14 and an electrode 3 to which a target 14...

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Bibliographische Detailangaben
Hauptverfasser: WATAI HISAO, SATO KAZUNAO, ONO KOICHI, TSUDA MUTSUMI, ITO HIROMI, NANBA TAKANORI, KOJIMA KAZUYOSHI, HIGAKI TAKASHI, KOKAMA TETSUO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To prevent the thermal stress cracking of a target by finely dividing the target in the plasma treating device with a groove of specified shape and preventing an ion in plasma from reaching the surface of a target electrode. CONSTITUTION:A substrate 14 and an electrode 3 to which a target 14 is fixed are opposed to each other in a vessel 1 evacuated with an exhaust port 1b, a permanent magnet 16 or a magnetic coil is embedded in the electrode 3, and the target 14 is divided by an obliquely cut groove into many small-piece targets 14a. A discharge gas 1a of Ar, etc., is introduced into the vessel 1, a high-frequency voltage is impressed on the target electrode 3 from a power source 10 to generate a glow discharge, the target is bombarded with the Ar ion in the plasma, and a thin film of the target material is formed on the substrate 4. Since the cut surface of the target 14a is inclined, the Ar ion does not directly hit the target electrode 3, and, even when the target 14b is expanded by the thermal stress, the expansion is absorbed by the groove, and the target is never cracked.