ELECTRIC CIRCUIT WIRING BOARD, MANUFACTURE THEREOF AND ELECTRIC CIRCUIT DEVICE

PURPOSE:To prevent an electrode of an electronic component from deviating from the right position on a conductive land when the electronic component is surface-mounted on a electric circuit wiring board. CONSTITUTION:Between conductive lands 2A that are formed on an insulating substrate 1 and that c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SETO KEIJI, HASHIMOTO TOSHIO, ISHIKAWA NATSUYA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To prevent an electrode of an electronic component from deviating from the right position on a conductive land when the electronic component is surface-mounted on a electric circuit wiring board. CONSTITUTION:Between conductive lands 2A that are formed on an insulating substrate 1 and that constitute an electric circuit, insulating material 3 that is different from the material of the insulating substrate 1 is located. The surface height of the conductive lands 2A is set lower than that of the insulating material 3. An electronic component is surface-mounted on this wiring board 5 so that electrodes of the electronic component may be inserted onto the conductive lands 2A. Since the electronic component is surface-mounted with its electrodes being inserted ants the conductive lands 2A whose surface height is lower than that of the insulating material 3, the electrodes of the electronic component do not deviate from the right position and a solder bridge can be prevented due to a wall of the insulating material 3.