MANUFACTURE OF SEMICONDUCTOR DEVICE

PURPOSE:To cut down the manufacturing cost of a chip-on-chip device which is excellent in productivity by a method wherein a semiconductor chip is mounted on a plurality of semiconductor substrates in the state of wafer before they ar individually cut, and then the semiconductor substrates are cut into pieces. CONSTITUTION:A wafer 6 contains a number of semiconductor substrates 2. Each semiconductor substrate 2 contains a bonding pad part 4. The bonding pad part 4 contains the solder wetting metal layer such as Cu and Au, for example. When the semiconductor substrate 2 of a chip-on-chip device is in a wafer state, a semiconductor chip 1 is flip-chip bonded on the abovementioned semiconductor substrate 2. As a result, a plurality of chip-on-chip devices are manufactured simultaneously, and lastly, the chip-on-chip devices are separated into individual pieces. Accordingly, the man-hours for the manufacture of the chip-on-chip devices can be reduced and the manufacturing cost can also be cut down.