PACKAGE FOR HIGH FREQUENCY CIRCUIT

PACKAGE FOR HIGH FREQUENCY CIRCUIT

PURPOSE:To prevent the deterioration of property by attenuating the high frequency component mixed in from leads, since the leads are taken out via a magnetic member. CONSTITUTION:A magnetic body or a member 3 including a magnetic body is arranged, so that it may surround a lead 2, at the wall face...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: TAWARA KAZUHIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE:To prevent the deterioration of property by attenuating the high frequency component mixed in from leads, since the leads are taken out via a magnetic member. CONSTITUTION:A magnetic body or a member 3 including a magnetic body is arranged, so that it may surround a lead 2, at the wall face where the lead for DC bias which supplies a high frequency circuit with a bias current pierces.