PHOTORESIST PAINTING DEVICE

PURPOSE:To make photoresist filled in a resist tank uniform in concentration. CONSTITUTION:Photoresist 4 is drawn up from a resist tank 10 by a photoresist applicator and made to drop down on a wafer 1 mounted on a spin chuck 2 from a nozzle 5, and a photoresist film is formed on the surface of the...

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Bibliographische Detailangaben
Hauptverfasser:	UEHARA MICHIYO, TAMIYA YOICHIRO, OKANE SHINYA, KANAI SHOJI, KUROIWA KEIZO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To make photoresist filled in a resist tank uniform in concentration. CONSTITUTION:Photoresist 4 is drawn up from a resist tank 10 by a photoresist applicator and made to drop down on a wafer 1 mounted on a spin chuck 2 from a nozzle 5, and a photoresist film is formed on the surface of the wafer 1 keeping it spinning. A circulation pipe 20 equipped with a circulating pump 21 at its halfway point is linked between the upper part and lower part of the resist tank 10. The lower part of photoresist 4 in the tank 10 is returned to the upper part of the photoresist by driving the circulating pump 21. By this operation, the photoresist 4 starts circulating, whereby the photoresist 4 is set uniform in concentration in the tank 10. As the photoresist 4 always uniform in concentration is fed to the wafer 1, a photoresist film formed on the surface of a wafer is uniform in quality and thickness.