BASE MATERIAL FOR ADHERENT SHEET FOR ADHERING WAFER AND THE SHEET
PURPOSE:To suppress influence of contaminant substance and to improve reliability of a semiconductor by laminating a first constituting layer made of at least plasticizer-containing vinyl chloride series polymer and a second constituting layer made of ethylene.(meth)acrylate copolymer. CONSTITUTION:...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | YOSHII JUNJI HOSONO SHIGERU EBE KAZUYOSHI MINEURA YOSHIHISA MORII HITOSHI |
| description | PURPOSE:To suppress influence of contaminant substance and to improve reliability of a semiconductor by laminating a first constituting layer made of at least plasticizer-containing vinyl chloride series polymer and a second constituting layer made of ethylene.(meth)acrylate copolymer. CONSTITUTION:An adherent sheet 1 for adhering a wafer has a base material 1 of a laminating film having at least two constituting layers and an adhesive layer 2. At least one of the constituting layers is made of plasticizer-containing vinyl chloride series polymer (first constituting layer 1a). At least one layer except the first constituting layer 1a is formed of ethylene.(meth)acrylate copolymer (second constituting layer 1b) and is so formed as to be brought into contact with the layer 1a and disposed at the side of the layer 2. The second layer 1b is formed of ethylene.(meth)acrylate copolymer obtained by copolymerizing ethylene and acrylic acid and/or methacrylic acid, and a content of a constituent unit to be derived from the acrylic acid and/or methacrylic acid in the copolymer is 5-30wt.%. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH06134941A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH06134941A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH06134941A3</originalsourceid><addsrcrecordid>eNrjZHB0cgx2VfB1DHEN8nT0UXDzD1JwdPFwDXL1C1EI9nB1DUEIefq5K4Q7urkCuX4uCiEerhAFPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7Uk3ivAw8DM0NjE0sTQ0ZgYNQCQzSqC</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>BASE MATERIAL FOR ADHERENT SHEET FOR ADHERING WAFER AND THE SHEET</title><source>esp@cenet</source><creator>YOSHII JUNJI ; HOSONO SHIGERU ; EBE KAZUYOSHI ; MINEURA YOSHIHISA ; MORII HITOSHI</creator><creatorcontrib>YOSHII JUNJI ; HOSONO SHIGERU ; EBE KAZUYOSHI ; MINEURA YOSHIHISA ; MORII HITOSHI</creatorcontrib><description>PURPOSE:To suppress influence of contaminant substance and to improve reliability of a semiconductor by laminating a first constituting layer made of at least plasticizer-containing vinyl chloride series polymer and a second constituting layer made of ethylene.(meth)acrylate copolymer. CONSTITUTION:An adherent sheet 1 for adhering a wafer has a base material 1 of a laminating film having at least two constituting layers and an adhesive layer 2. At least one of the constituting layers is made of plasticizer-containing vinyl chloride series polymer (first constituting layer 1a). At least one layer except the first constituting layer 1a is formed of ethylene.(meth)acrylate copolymer (second constituting layer 1b) and is so formed as to be brought into contact with the layer 1a and disposed at the side of the layer 2. The second layer 1b is formed of ethylene.(meth)acrylate copolymer obtained by copolymerizing ethylene and acrylic acid and/or methacrylic acid, and a content of a constituent unit to be derived from the acrylic acid and/or methacrylic acid in the copolymer is 5-30wt.%.</description><edition>5</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING</subject><creationdate>1994</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940517&DB=EPODOC&CC=JP&NR=H06134941A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940517&DB=EPODOC&CC=JP&NR=H06134941A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOSHII JUNJI</creatorcontrib><creatorcontrib>HOSONO SHIGERU</creatorcontrib><creatorcontrib>EBE KAZUYOSHI</creatorcontrib><creatorcontrib>MINEURA YOSHIHISA</creatorcontrib><creatorcontrib>MORII HITOSHI</creatorcontrib><title>BASE MATERIAL FOR ADHERENT SHEET FOR ADHERING WAFER AND THE SHEET</title><description>PURPOSE:To suppress influence of contaminant substance and to improve reliability of a semiconductor by laminating a first constituting layer made of at least plasticizer-containing vinyl chloride series polymer and a second constituting layer made of ethylene.(meth)acrylate copolymer. CONSTITUTION:An adherent sheet 1 for adhering a wafer has a base material 1 of a laminating film having at least two constituting layers and an adhesive layer 2. At least one of the constituting layers is made of plasticizer-containing vinyl chloride series polymer (first constituting layer 1a). At least one layer except the first constituting layer 1a is formed of ethylene.(meth)acrylate copolymer (second constituting layer 1b) and is so formed as to be brought into contact with the layer 1a and disposed at the side of the layer 2. The second layer 1b is formed of ethylene.(meth)acrylate copolymer obtained by copolymerizing ethylene and acrylic acid and/or methacrylic acid, and a content of a constituent unit to be derived from the acrylic acid and/or methacrylic acid in the copolymer is 5-30wt.%.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1994</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB0cgx2VfB1DHEN8nT0UXDzD1JwdPFwDXL1C1EI9nB1DUEIefq5K4Q7urkCuX4uCiEerhAFPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7Uk3ivAw8DM0NjE0sTQ0ZgYNQCQzSqC</recordid><startdate>19940517</startdate><enddate>19940517</enddate><creator>YOSHII JUNJI</creator><creator>HOSONO SHIGERU</creator><creator>EBE KAZUYOSHI</creator><creator>MINEURA YOSHIHISA</creator><creator>MORII HITOSHI</creator><scope>EVB</scope></search><sort><creationdate>19940517</creationdate><title>BASE MATERIAL FOR ADHERENT SHEET FOR ADHERING WAFER AND THE SHEET</title><author>YOSHII JUNJI ; HOSONO SHIGERU ; EBE KAZUYOSHI ; MINEURA YOSHIHISA ; MORII HITOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH06134941A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1994</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHII JUNJI</creatorcontrib><creatorcontrib>HOSONO SHIGERU</creatorcontrib><creatorcontrib>EBE KAZUYOSHI</creatorcontrib><creatorcontrib>MINEURA YOSHIHISA</creatorcontrib><creatorcontrib>MORII HITOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHII JUNJI</au><au>HOSONO SHIGERU</au><au>EBE KAZUYOSHI</au><au>MINEURA YOSHIHISA</au><au>MORII HITOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>BASE MATERIAL FOR ADHERENT SHEET FOR ADHERING WAFER AND THE SHEET</title><date>1994-05-17</date><risdate>1994</risdate><abstract>PURPOSE:To suppress influence of contaminant substance and to improve reliability of a semiconductor by laminating a first constituting layer made of at least plasticizer-containing vinyl chloride series polymer and a second constituting layer made of ethylene.(meth)acrylate copolymer. CONSTITUTION:An adherent sheet 1 for adhering a wafer has a base material 1 of a laminating film having at least two constituting layers and an adhesive layer 2. At least one of the constituting layers is made of plasticizer-containing vinyl chloride series polymer (first constituting layer 1a). At least one layer except the first constituting layer 1a is formed of ethylene.(meth)acrylate copolymer (second constituting layer 1b) and is so formed as to be brought into contact with the layer 1a and disposed at the side of the layer 2. The second layer 1b is formed of ethylene.(meth)acrylate copolymer obtained by copolymerizing ethylene and acrylic acid and/or methacrylic acid, and a content of a constituent unit to be derived from the acrylic acid and/or methacrylic acid in the copolymer is 5-30wt.%.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JPH06134941A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING |
| title | BASE MATERIAL FOR ADHERENT SHEET FOR ADHERING WAFER AND THE SHEET |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T12%3A57%3A05IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YOSHII%20JUNJI&rft.date=1994-05-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH06134941A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |